Iec 603525 Pdf – Safe

The standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," provides the definitive technical framework for evaluating press-fit technology in electronic assemblies. As of 2026, the current version is Edition 5.0 (2020) , which modernized the standard to include a broader range of board materials beyond traditional printed circuit boards (PCBs).

Components with a dedicated press-in zone designed for insertion into holes.

While earlier editions focused primarily on telecommunication equipment, the IEC 60352-5:2020 edition expanded its scope to all . It specifically covers: iec 603525 pdf

It specifies suitable materials and surface finishes to prevent corrosion and ensure stable electrical contact. Testing Methodologies

It defines procedures for measuring press-in force (insertion) and push-out force (retention). The 2020 edition introduced requirements for graphical documentation of these force profiles. The standard, titled "Solderless connections - Part 5:

Connector manufacturers, PCB designers, test labs, and quality assurance teams. Key Technical Requirements

The standard is essential for manufacturers and engineers to ensure that solderless connections remain electrically stable and mechanically robust under varying environmental stresses. Scope and Applications and plating. For example

Traditional double-sided or multilayer PCBs, as well as non-PCB materials like metal boards.

IEC 60352-5 outlines two distinct test schedules to validate performance: Go to product viewer dialog for this item. IEC 60352-5 Ed. 5.0 b:2020

It provides guidelines for hole diameters, tolerances, and plating. For example, deformation of the drilled hole contour in a plated-through hole must typically be less than 70 μm , with a minimum remaining plating thickness of 8 μm .